Selected Publications and Conference Papers (past 5 years) [1]Youkang Yin, Yufei Gao*,et al. Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw. Materials Science in Semiconductor Processing, 2020, 106:104779 [2] Xinying Li, Yufei Gao*, et al. Experiment and theoretical prediction for surface roughness of PV polycrystalline silicon wafer in electroplated diamond wire sawing. Journal of Manufacturing Processes, 2020, 49:82-93 [3] Hongshuang Li, Yufei Gao*, et al. Sulfamate nickel pre-plating for preparation of diamond wire saw by electroplating. Electroplating & Finishing, 2019:38(21):1152-1155. [4] J Pang, Y Gao*, et al. Surface characteristics and wire wear of electroplated diamond wire saw slicing photovoltaic polycrystalline silicon. Diamond & Abrasives Engineering, 2019 : 39(5) : 92-9. [5] Yufei Gao*, et al. Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal, Materials Science in Semiconductor Processing, 2019, 103:104642 [6] Yufei Gao*, et al. Sawing Stress of SiC Single Crystal with Void Defect in Diamond Wire Saw Slicing. International Journal of Advanced Manufacturing Technology. 2019, 103(1):1019–1031 [7] Xinying Li, Yufei Gao*, et al. Nucleation location and propagation direction of radial and median cracks for brittle material in scratching. Ceramics International, 2019, 45(6):7524–7536 [8] Xinying Li, Yufei Gao*, et al. The Effect of Cut Depth and Distribution for Abrasives on Wafer Surface Morphology in Diamond Wire Sawing of PV Polycrystalline Silicon, Materials Science in Semiconductor Processing, 2019, 91: 316-326 [9] Yufei Gao*, et al. Study on the subsurface microcrack damage depth in electroplated diamond wire saw slicing SiC crystal, Ceramics International, 2018, 44(18):22927–22934. [10] Hongshuang Li, Yufei Gao*, et al. Analysis of factors affecting the wafer warpage of wire saw. Tool Engineering, 2018:52(12):54-57.
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